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Advisory Board GSEF 2017

GEF Advisory Board

Eiji Fujii

Eiji Fujii
Executive Officer, Panasonic Corporation

Eiji Fujii received the M.S. degree in applied physics from Osaka University of Japan in 1984. Since joining Panasonic Corporation, he has been engaged in the research and development of the semiconductor leading-edge devices. He won many awards including the Corporate Innovation Award and Award for Lifetime Achievement of International Symposium on Integrated Ferroelectrics in 2004 for the world first industrialization of 180nm ferroelectric nonvolatile memories.  Currently, he is a member of the Executive Committee of VLSI Symposium.

Now, he is an Executive Officer of Panasonic Corporation and Vice President CTO of Automotive & Industrial Systems Company.


Hamid Azimi

Sajjad Khan
Vice President Digital Vehicle & Mobility, Daimler AG

Having completed a masters degree in Information & Communication Technology, specializing in product engineering, as well as initial international projects in the industry, Sajjad Khan joined DaimlerChrysler AG in 2001. During his time there he worked on various projects in the field of infotainment before transferring to the materials purchasing department in 2004, where he procured electronic components for cars.

Sajjad Khan moved to MAGNA in 2007, where he gained experience as director of the e-car and electronics unit, and also worked in global procurement.

Since 2011 he has been working for BMW Group AG. In his position as Vice President he was most recently responsible for Connected Drive worldwide.

Since spring 2015, Sajjad Khan is responsible for Digital Vehicle & Mobility as Vice President Digital at Daimler AG.


GSF Advisory Board

Sajjad Khan

Hamid R. Azimi
Vice president, Director of Substrate Packaging Technology Development, Intel Corporation

Hamid R. Azimi is vice president in the Technology and Manufacturing Group and director of Substrate Packaging Technology Development at Intel Corporation. He is responsible for substrate path-finding, technology development and initial ramp—up for Intel logic products across all substrate suppliers’ factories, as well as the company‘s CH1 and CH8 substrate R&D factories in Arizona.

Since joining Intel in 1995 as a senior packaging engineer, Azimi has focused on substrate packaging and assembly material technology development by working with suppliers around the globe. His contributions include leading Intel’s FCxGA substrate and assembly materials development effort through significant changes over the course of a decade to meet aggressive design rules and stringent material requirements. More recently, Azimi and his team successfully developed a world—class internal substrate development capability, essentially from the ground up, in 3 years in support of Intel’s substrate strategy.

A recognized expert in the substrate industry, Azimi holds more than a dozen patents related to substrate packaging materials, design and architecture, with additional patents pending. He has also published several papers and has given invited talks at international conferences. He and his team have won multiple Intel Achievement Awards, including one for leading the C4 package transition from costly OLGA to FCxGA packaging and one for enabling first-generation halogen-free and lead-free flip chip substrate.

Azimi received his bachelor’s degree in metallurgical engineering from Sharif University of Technology in Tehran, Iran, and his master’s degree and PhD. in materials science and engineering from Lehigh University in Bethlehem, Penn.